Design for AM Electronics – April 2021
Key Research Theme Leader:
Dr Robert Kay – University of Leeds
Additive manufacturing creates new opportunities for the manufacture of electronics products instead of standard surface mount assembly on printed circuit boards, with potential benefits including miniaturisation and improved performance, but the performance, density and reliability of high-density multilayer boards and advanced packaging techniques are significantly more advanced than current AM technologies.
This theme aims to generate a greater understanding, identify drivers and motivation and facilitate multidisciplinary discussions, cross-fertilisation of ideas and drive future innovation in additive manufacturing for electronic systems.